Polishing pad is a consolidated diamond lapping tool with special structure. It is prepared by uniformly dispersing diamond powder in organic resin adhesive. It is suitable for processing a variety of hard and brittle materials such as glass, ceramics and semiconductor substrates.
Sesame grinding head belongs to a type of grinding head, which can achieve both grinding and polishing effects at the same time, and is not easy to burn the workpiece. It can quickly polish the original rough surface of any mechanical processing. Especially suitable for processing aluminum alloy products.