Polishing pad is a consolidated diamond lapping tool with special structure. It is prepared by uniformly dispersing diamond powder in organic resin adhesive. It is suitable for processing a variety of hard and brittle materials such as glass, ceramics and semiconductor substrates.
Sesame grinding head belongs to a type of grinding head, which can achieve both grinding and polishing effects at the same time, and is not easy to burn the workpiece. It can quickly polish the original rough surface of any mechanical processing. Especially suitable for processing aluminum alloy products.
Used in the processing of material, such as hard alloy, precision ceramics, magnetic materials,PCD/PCBN composite plate. It' s suitable for 1040、1050、10100 series models of centerless grinding machine; with the characteristic of effective and high-volume cylindrical grinding, high precision cylindricity of workpiece, consistent size, smooth finish of precision grinding workpiece.
Mainly used in the processing of plane grinding, edge grinding, such as hard alloy, precision ceramics, high-speed steel, cemented steel and various superhard cutting tools; with the advantages of high grinding efficiency, good smoothness and so on.